Addressing Modern Data Center Challenges and HPC/AI Workload Demands

Both high-performance computing (HPC) and artificial intelligence (AI) are pushing data centers to their limits, challenging traditional cooling and monitoring systems. The following whitepaper presents DDC’s extensive solution to address the data center challenges that arise from the integration of these technologies. The S-Series cabinet, capable of ultra-high-density cooling up to 100kW for air cooling and 400kW for liquid-to-chip cooling, offers flexibility for both HPC and AI workloads. This cabinet, combined with DCIM monitoring software, enables real-time monitoring, dynamic cooling adjustments, and efficient scaling. DDC’s approach reduces operational risks, lowers total cost of ownership, and provides future-proof adaptability. DDC’s solutions are currently used in 1,100 global deployments, tackling key industry challenges like accommodating different workload densities, managing dynamic cooling needs, and protecting high-value assets – all while ensuring energy efficiency and scalability within the data center.