LITEON Integrated Power and Cooling Solutions to Meet AI Workload Needs

In the HPC and AI era, the power needed to run HPC and AI workloads has increased. HPC data center infrastructure can run HPC workloads but face heat and thermal issues. Running these workloads may surpass CPU and GPU built-in power and Thermal Design Power (TDP) temperature thresholds. Data centers increasingly use more power and generate more heat resulting in increased operating costs (OPEX). Traditional data center air-cooling cannot meet modern data center cooling needs. With the increased heat generated, data centers require specialized power and cooling solutions.

LITEON Technology provides a wide range of power and cooling solutions including integrated power, cabinet, and liquid cooling systems which comply with the NVIDIA Blackwell architecture design. LITEON helps customers accelerate the integration of next-generation AI server cabinets, creating efficient and energy-saving data centers to meet the growing high-performance computing demands of the AI era.

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